PackageLFBGA
MountingSurface Mount
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Technical Specifications
Intel PEF 20525 E V1.2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
80
PCB
80
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
1.5
Package Material
Plastic
Mounting
Surface Mount
Category
Synchronous Serial Controller
Maximum Data Rate
12.5Mbps
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Power Supply Type
Analog|Digital
Typical Supply Current
50(Max)mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PEF 20525 E V1.2 Datasheet
Download the complete datasheet for Intel PEF 20525 E V1.2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.