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Technical Specifications
Intel PEF 22552 E V1.1-G technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 160 |
| PCB | 160 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 1.6(Max) - 0.3(Min) |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Standard Framing Format | E1|J1|T1 |
| Number of Transceivers | 1 |
| Maximum Data Rate | 2.048Mbps |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Power Supply Type | Analog |
| Typical Operating Supply Voltage | 3.3V |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Intel PEF 22552 E V1.1-G Datasheet
Download the complete datasheet for Intel PEF 22552 E V1.1-G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.