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Technical Specifications
Intel PEF 3314 E V2.2-G technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
176
PCB
176
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.5(Max) - 0.3(Min)
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Category
Analog Telephony Solution
Maximum Data Rate
40Kbps
Transmission Media Type
Cable
Power Supply Type
Analog
Compliance
Cage Code
4BA62
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PEF 3314 E V2.2-G Datasheet
Download the complete datasheet for Intel PEF 3314 E V2.2-G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.