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Technical Specifications
Intel PEF 3314 EL V2.1 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 144 |
| PCB | 144 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 1.6(Max) - 0.3(Min) |
| Seated Plane Height (mm) | 1.6(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Analog Telephony Solution |
| Maximum Data Rate | 40Kbps |
| Transmission Media Type | Cable |
| Power Supply Type | Analog |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Intel PEF 3314 EL V2.1 Datasheet
Download the complete datasheet for Intel PEF 3314 EL V2.1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.