PackageLBGA
MountingSurface Mount
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Technical Specifications
Intel PEF22624EV1.3G technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
4BA62
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PEF22624EV1.3G Datasheet
Download the complete datasheet for Intel PEF22624EV1.3G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.