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Technical Specifications
Intel PEF24471EV1.3 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
217
PCB
217
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
1.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Category
Switching IC
Maximum Data Rate
16.384Mbps
Transmission Media Type
Cable
Max Operating Supply Voltage
3.47|5.25V
Min Operating Supply Voltage
3.13|4.75V
Power Supply Type
Analog
Typical Supply Current
250(Max)mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
4BA62
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PEF24471EV1.3 Datasheet
Download the complete datasheet for Intel PEF24471EV1.3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.