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Technical Specifications
Intel PEF3460EV1.2 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 272 |
| PCB | 272 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 2.13 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Standard Framing Format | E3|T3 |
| Number of Transceivers | 1 |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Intel PEF3460EV1.2 Datasheet
Download the complete datasheet for Intel PEF3460EV1.2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.