PackageBGA
MountingSurface Mount
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Technical Specifications
Intel PLB2800EV1.2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
388
PCB
388
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
1.66
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
4BA62
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PLB2800EV1.2 Datasheet
Download the complete datasheet for Intel PLB2800EV1.2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.