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Technical Specifications
Intel PSB 21553 E V1.4 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Material
Plastic
Mounting
Surface Mount
Category
VoIP System
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
4BA62
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PSB 21553 E V1.4 Datasheet
Download the complete datasheet for Intel PSB 21553 E V1.4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.