1-Line ISDN S/T/U interface IC with HDLC control, supporting 192Kbps transmission. This Thin Quad Flat Package (TQFP) component features 64 gull-wing leads on a 0.5mm pitch, designed for surface mounting. Operating from a 3.3V supply, it functions within a 0°C to 70°C temperature range. The plastic package measures 10mm x 10mm x 1.4mm.
PackageTQFP
MountingSurface Mount
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Technical Specifications
Intel PSB21150FV1.4 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BCD
Number of Line Interfaces
1
Category
S/T/U
Control Interface
HDLC
Transmission Data Rate
192Kbps
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Max Operating Supply Voltage
3.465V
Min Operating Supply Voltage
3.135V
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PSB21150FV1.4 Datasheet
Download the complete datasheet for Intel PSB21150FV1.4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.