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Technical Specifications
Intel PXB4219EV3.4 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.53
Seated Plane Height (mm)
2.13
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Frame Format Support
T1|E1
Data Rate
2.048Mbps
Type of ATM PHY Interface
ITU-T I.432|ITU-T I.432.3
Number of Channels per Chip
1
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Min Operating Supply Voltage
3.15V
Max Operating Supply Voltage
3.45V
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PXB4219EV3.4 Datasheet
Download the complete datasheet for Intel PXB4219EV3.4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.