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Technical Specifications
Intel PXB4221EV3.4 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.53 |
| Seated Plane Height (mm) | 2.13 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Frame Format Support | T1|E1 |
| Data Rate | 2.048Mbps |
| Type of ATM PHY Interface | ITU-T I.432|ITU-T I.432.3 |
| Number of Channels per Chip | 1 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Min Operating Supply Voltage | 3.15V |
| Max Operating Supply Voltage | 3.45V |
| Typical Operating Supply Voltage | 3.3V |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Intel PXB4221EV3.4 Datasheet
Download the complete datasheet for Intel PXB4221EV3.4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.