Telecom IC, ATM UNI Single, 2.048 Mbps data rate, supporting ITU-T I.432 and ITU-T I.432.3 interfaces. This surface mount component features a 256-pin BGA package with a 1.27mm pin pitch, measuring 27mm x 27mm x 1.53mm. Operates with a 3.3V supply voltage, from -40°C to 85°C, and supports T1|E1 frame formats.
PackageBGA
MountingSurface Mount
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Technical Specifications
Intel PXB4221EV34NP technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.53
Seated Plane Height (mm)
2.13
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
TO-251AA
Frame Format Support
T1|E1
Data Rate
2.048Mbps
Type of ATM PHY Interface
ITU-T I.432|ITU-T I.432.3
Number of Channels per Chip
1
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Min Operating Supply Voltage
3.15V
Max Operating Supply Voltage
3.45V
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PXB4221EV34NP Datasheet
Download the complete datasheet for Intel PXB4221EV34NP to view detailed technical specifications.
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