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Technical Specifications
Intel PXF 4333 E V1.1 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 456 |
| PCB | 456 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 1.7 |
| Seated Plane Height (mm) | 2.3 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Intel PXF 4333 E V1.1 Datasheet
Download the complete datasheet for Intel PXF 4333 E V1.1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.