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Technical Specifications
Intel PXF4222EV1.3 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
388
PCB
388
Package Material
Plastic
Mounting
Surface Mount
Standard Framing Format
E1|J1|T1
Number of Transceivers
1
Maximum Data Rate
16Mbps
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Power Supply Type
Analog
Typical Operating Supply Voltage
1.8|3.3V
Compliance
Cage Code
4BA62
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PXF4222EV1.3 Datasheet
Download the complete datasheet for Intel PXF4222EV1.3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.