The Intel PXF4270EV12NP is a surface mount Ball Grid Array (BGA) package with 324 pins, measuring 19mm in length and width, and a maximum height of 1.5mm. It operates over a temperature range of -40°C to 85°C and is suitable for use in telecom applications. The device is an ATM buffer manager with an analog power supply type and is categorized as a specialized IC.
PackageLBGA
MountingSurface Mount
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Technical Specifications
Intel PXF4270EV12NP technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.5(Max) - 0.3(Min) |
| Seated Plane Height (mm) | 1.5(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | ATM Buffer Manager |
| Power Supply Type | Analog |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Typical Operating Supply Voltage | 1.5|3.3V |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Intel PXF4270EV12NP Datasheet
Download the complete datasheet for Intel PXF4270EV12NP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.