The FDB3632-SB82115 is a surface mount MOSFET packaged in a TO-263 D2PAK with a gull-wing lead shape. It has a maximum package length of 10.67mm, width of 9.65mm, and height of 4.83mm. The seated plane height is 5.08mm. The package is made of plastic and is suitable for surface mount applications.
PackageD2PAK
MountingSurface Mount
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Technical Specifications
Onsemi FDB3632-SB82115 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | TO-263 |
| Package/Case | D2PAK |
| Package Description | Double Deca Watt Package |
| Lead Shape | Gull-wing |
| Pin Count | 3 |
| PCB | 2 |
| Tab | Tab |
| Package Length (mm) | 10.67(Max) |
| Package Width (mm) | 9.65(Max) |
| Package Height (mm) | 4.83(Max) |
| Seated Plane Height (mm) | 5.08(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes with Exemption |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi FDB3632-SB82115 Datasheet
Download the complete datasheet for Onsemi FDB3632-SB82115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.