The MDM-25SBSP is a high-density microminiature D-sub connector featuring 25 socket contacts on a 1.27mm (0.050 inch) pitch. It is constructed with a rugged aluminium alloy shell with electroless nickel plating for EMI/RFI shielding and environmental protection. This specific configuration includes solder pot terminations and a metal shell plug housing designed for military, industrial, and commercial applications requiring moisture resistance and reliable performance under high vibration.
Temp Range-55 to +125°C
Current Rating3A
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Technical Specifications
ITT MDM-25SBSP technical specifications.
General
| Number of Positions | 25 |
| Contact Gender | Socket (Female) |
| Pitch | 1.27mm |
| Termination Type | Solder Pot |
| Current Rating | 3A |
| Contact Resistance | 8milliohms |
| Operating Temperature Range | -55 to +125°C |
| Dielectric Withstanding Voltage | 600VAC |
| Shell Material | Aluminium Alloy |
| Shell Plating | Electroless Nickel |
Compliance
| RoHS | Compliant |
| Military Standard | MIL-DTL-83513 (Equivalent Performance) |
Datasheet
ITT MDM-25SBSP Datasheet
Download the complete datasheet for ITT MDM-25SBSP to view detailed technical specifications.
No datasheet is available for this part.