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Technical Specifications
Ixys ZGP323LES2008C00TR technical specifications.
General
Package/Case
SOIC
Core Architecture
Z8
Max Operating Temperature
105°C
Memory Size
8KB
Memory Type
OTP,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
16
Oscillator Type
Internal
Packaging
Tape and Reel
Peripherals
POR, WDT, HLVD
Series
Z8® GP™
Compliance
RoHS
Not Compliant
Datasheet
Ixys ZGP323LES2008C00TR Datasheet
Download the complete datasheet for Ixys ZGP323LES2008C00TR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.