Japan Aviation Electronics Industry
FI-NXB40SL-HF10-R3000
Conn Board to Board RCP 40 POS 0.8mm Solder RA SMD T/R
Conn Board to Board RCP 40 POS 0.8mm Solder RA SMD T/R
MountingSurface Mount
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Technical Specifications
Japan Aviation Electronics Industry FI-NXB40SL-HF10-R3000 technical specifications.
General
| Type | Board to Board |
| Gender | RCP |
| Number of Contacts | 40 |
| Terminal Pitch | 0.8mm |
| Number of Rows | 1 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Body Orientation | Right Angle |
| Mounting | Surface Mount |
| Max Current Rating | 0.5/ContactA |
| Max Voltage Rating | 200VDC|200VAC |
| Height | 3.3mm |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU |
Datasheet
Japan Aviation Electronics Industry FI-NXB40SL-HF10-R3000 Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry FI-NXB40SL-HF10-R3000 to view detailed technical specifications.
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