Japan Aviation Electronics Industry
IL-12P-S3FP2
Conn Wire to Board HDR 12 POS 2.5mm Solder RA Thru-Hole
MountingThrough Hole
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Technical Specifications
Japan Aviation Electronics Industry IL-12P-S3FP2 technical specifications.
General
| Type | Wire to Board |
| Gender | HDR |
| Number of Contacts | 12 |
| Terminal Pitch | 2.5mm |
| Number of Rows | 1 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Body Orientation | Right Angle |
| Mounting | Through Hole |
| Height | 6.5mm |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU |
Datasheet
Japan Aviation Electronics Industry IL-12P-S3FP2 Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry IL-12P-S3FP2 to view detailed technical specifications.
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