Japan Aviation Electronics Industry
IL-2P-S3FP2-1
2-Position HDR Wire to Board Header, 2.5mm Pitch, Through Hole Mount
This 2-position HDR wire to board header features a right angle body orientation and a termination method of solder. It is designed for through hole mounting and has a terminal pitch of 2.5mm. The header has a maximum current rating of 3A and a height of 6.5mm. It is suitable for applications where a compact and reliable connection is required.
MountingThrough Hole
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Technical Specifications
Japan Aviation Electronics Industry IL-2P-S3FP2-1 technical specifications.
General
| Type | Wire to Board |
| Gender | HDR |
| Number of Contacts | 2 |
| Terminal Pitch | 2.5mm |
| Number of Rows | 1 |
| Termination Method | Solder |
| Body Orientation | Right Angle |
| Mounting | Through Hole |
| Max Current Rating | 3A |
| Height | 6.5mm |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU, 2015/863 |
Datasheet
Japan Aviation Electronics Industry IL-2P-S3FP2-1 Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry IL-2P-S3FP2-1 to view detailed technical specifications.
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