Japan Aviation Electronics Industry
IL-8P-S3FP2-1
8-Contact HDR Wire-to-Board Header, 2.5mm Pitch, Through Hole Mount
This 8-contact HDR wire-to-board header features a 2.5mm pitch and is designed for through hole mounting. It has a right-angle body orientation and operates within a temperature range of -40°C to 85°C. The termination method is solder, and it is suitable for use in applications where a secure connection is required.
MountingThrough Hole
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Technical Specifications
Japan Aviation Electronics Industry IL-8P-S3FP2-1 technical specifications.
General
| Type | Wire to Board |
| Gender | HDR |
| Number of Contacts | 8 |
| Terminal Pitch | 2.5mm |
| Number of Rows | 1 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Body Orientation | Right Angle |
| Mounting | Through Hole |
| Height | 6.5mm |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU |
Datasheet
Japan Aviation Electronics Industry IL-8P-S3FP2-1 Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry IL-8P-S3FP2-1 to view detailed technical specifications.
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