Japan Aviation Electronics Industry
IL-9P-S3FP2-1
Conn Wire to Board PIN 9 POS 2.5mm Solder RA Thru-Hole
MountingThrough Hole
Quick Jump:
Technical Specifications
Japan Aviation Electronics Industry IL-9P-S3FP2-1 technical specifications.
General
| Type | Wire to Board |
| Gender | PIN |
| Number of Contacts | 9 |
| Terminal Pitch | 2.5mm |
| Number of Rows | 1 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Body Orientation | Right Angle |
| Mounting | Through Hole |
| Max Current Rating | 3A |
| Height | 6.5mm |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU |
Datasheet
Japan Aviation Electronics Industry IL-9P-S3FP2-1 Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry IL-9P-S3FP2-1 to view detailed technical specifications.
No datasheet is available for this part.