Conn Board to Board RCP 80 POS 0.8mm Solder ST SMD
MountingSurface Mount
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Technical Specifications
Japan Aviation Electronics Industry KX14-80K8D1 technical specifications.
General
| Type | Board to Board |
| Gender | RCP |
| Number of Contacts | 80 |
| Terminal Pitch | 0.8mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Body Orientation | Straight |
| Mounting | Surface Mount |
| Max Current Rating | 0.5A |
| Max Voltage Rating | 300VDC|200VAC |
| Height | 9.55mm |
Compliance
| RoHS | No |
| RoHS Version | 2011/65/EU, 2015/863 |
Datasheet
Japan Aviation Electronics Industry KX14-80K8D1 Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry KX14-80K8D1 to view detailed technical specifications.
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