Japan Aviation Electronics Industry
TX25-80P-8ST-H1
80-Contact PL Board-to-Board Header, 1.27mm Pitch, Through Hole Mount
The TX25-80P-8ST-H1 is a board-to-board header from Japan Aviation Electronics Industry, designed for use in applications requiring high-density interconnects. This header features 80 contacts, arranged in a 2-row configuration with a terminal pitch of 1.27mm. It is constructed for through-hole mounting and has a maximum current rating of 1A. The operating temperature range is -40°C to 80°C, making it suitable for use in a variety of environments. The header has a straight body orientation and a height of 11.2mm.
MountingThrough Hole
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Technical Specifications
Japan Aviation Electronics Industry TX25-80P-8ST-H1 technical specifications.
General
| Type | Board to Board |
| Gender | PL |
| Number of Contacts | 80 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 80°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 1A |
| Height | 11.2mm |
Compliance
| RoHS | No |
| RoHS Version | 2011/65/EU, 2015/863 |
Datasheet
Japan Aviation Electronics Industry TX25-80P-8ST-H1 Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry TX25-80P-8ST-H1 to view detailed technical specifications.
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