Kester 275 No-Clean Flux cored solder wire is developed for superior wetting performance in hand soldering electronic applications. The chemistry is based on mildly activated rosin flux principles and results in extremely clear post-soldering residues without the need for cleaning. This specific part is a lead-free SN965 alloy wire with 2.2% flux core, designed to reduce spattering and provide low smoke and odor during processing.
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| Alloy Composition | Sn96.5Ag3.0Cu0.5 (96.5% Tin / 3.0% Silver / 0.5% Copper) |
| Diameter | 0.031in |
| Diameter | 0.80mm |
| Flux Type | No-Clean (ROL0) |
| Flux Percentage | 2.2% |
| Melting Point | 217-218°C |
| Weight | 1lb |
| Wire Gauge | 21AWG |
| RoHS | Compliant |
| J-std-004 | ROL0 |
| REACH | Unaffected |
