16GB DDR3 SDRAM 240-DIMM module, operating at 1600 MHz with a 64-bit data bus width. Features dual ranks and a CAS latency of 10, organized as 1Gx64x2 with 32 chips per module. Utilizes FBGA chip packaging and a non-lead-frame SMT DIMM package measuring 133.35mm in length and 30mm in height. Designed for socket mounting with a typical operating voltage of 1.5V and a temperature range of 0°C to 85°C.
PackageDIMM
MountingSocket
Quick Jump:
Technical Specifications
Kingston KHX1600C10D3B1K2/16G technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
DIMM
Package Description
Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.35
Package Height (mm)
30
Pin Pitch (mm)
1
Mounting
Socket
Main Category
DRAM Module
Total Density
16Gbyte
Module Type
240DIMM
Maximum Clock Rate
1600MHz
Chip Density
4Gbit
Subcategory
DDR3 SDRAM
Data Bus Width
64bit
Number of Chip per Module
32
Organization
1Gx64x2
Chip Package Type
FBGA
Typical Operating Supply Voltage
1.5V
Min Operating Supply Voltage
1.425V
Max Operating Supply Voltage
1.575V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Chip Configuration
512Mx8
ECC Support
No
Number of Ranks
Dual
CAS Latency
10
Compliance
Cage Code
0P2J5
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Kingston KHX1600C10D3B1K2/16G Datasheet
Download the complete datasheet for Kingston KHX1600C10D3B1K2/16G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.