DDR3 SDRAM module with 8GB total density, organized as 512Mx64x2. Features a 240-pin DIMM package with a 1.0mm pin pitch, measuring 133.35mm in length, 7.24mm in width, and 53.9mm in height. Operates at a maximum clock rate of 1600 MHz with a CAS Latency of 9, utilizing a 64-bit data bus width. Supports a typical operating supply voltage of 1.5V and operates within a temperature range of 0°C to 85°C. This non-lead-frame SMT component is designed for socket mounting.
PackageDIMM
MountingSocket
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Technical Specifications
Kingston KHX16C9T2K2/8X technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | DIMM |
| Package Description | Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.35 |
| Package Width (mm) | 7.24 |
| Package Height (mm) | 53.9 |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 8Gbyte |
| Module Type | 240DIMM |
| Maximum Clock Rate | 1600MHz |
| Chip Density | 2Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 32 |
| Organization | 512Mx64x2 |
| Chip Package Type | FBGA |
| Typical Operating Supply Voltage | 1.5V |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 256Mx8 |
| ECC Support | No |
| Number of Ranks | Dual |
| CAS Latency | 9 |
Compliance
| Cage Code | 0P2J5 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Kingston KHX16C9T2K2/8X Datasheet
Download the complete datasheet for Kingston KHX16C9T2K2/8X to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.