DDR3 SDRAM 8GB 240-pin DIMM module featuring a 2133 MHz maximum clock rate. This module offers a 64-bit data bus width and is organized as 512Mx64x2, utilizing 32 FBGA packaged chips with 2Gb density each. Operating at a typical 1.5V supply voltage, it supports dual ranks and has a CAS latency of 11. Designed for socket mounting, the module operates within a temperature range of 0°C to 85°C.
Sign in to ask questions about the Kingston KHX2133C11D3T1K2/8GX datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Kingston KHX2133C11D3T1K2/8GX technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | DIMM |
| Package Description | Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.35 |
| Package Height (mm) | 61 |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 8Gbyte |
| Module Type | 240DIMM |
| Maximum Clock Rate | 2133MHz |
| Chip Density | 2Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 32 |
| Organization | 512Mx64x2 |
| Chip Package Type | FBGA |
| Typical Operating Supply Voltage | 1.5V |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 256Mx8 |
| ECC Support | No |
| Number of Ranks | Dual |
| CAS Latency | 11 |
| Cage Code | 0P2J5 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Kingston KHX2133C11D3T1K2/8GX to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
