DDR3 SDRAM module, 8GB total density, operating at a maximum clock rate of 2133 MHz. Features a 240-pin DIMM package with a 64-bit data bus width and single rank organization. Utilizes 16 FBGA chips, each with 4G bit density and 512Mx8 configuration. Typical operating supply voltage is 1.5V, with a CAS latency of 11. Designed for socket mounting and operates within a temperature range of 0°C to 85°C.
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| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | DIMM |
| Package Description | Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.35 |
| Package Width (mm) | 7.24 |
| Package Height (mm) | 53.9 |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 8Gbyte |
| Module Type | 240DIMM |
| Maximum Clock Rate | 2133MHz |
| Chip Density | 4Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 16 |
| Organization | 512Mx64x2 |
| Chip Package Type | FBGA |
| Typical Operating Supply Voltage | 1.5V |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 512Mx8 |
| ECC Support | No |
| Number of Ranks | Single |
| CAS Latency | 11 |
| Cage Code | 0P2J5 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
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