DDR3 SDRAM module, 8GB total density, 240-pin DIMM form factor. Features a 2666 MHz maximum clock rate, 64-bit data bus width, and CAS Latency of 11. Organized as 512Mx64x2 with 32 chips per module, each with 2G bit chip density and FBGA package type. Operates at a typical 1.5V supply voltage with a 0°C to 85°C temperature range.
PackageDIMM
MountingSocket
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Technical Specifications
Kingston KHX26C11T2K2/8X technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
DIMM
Package Description
Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.35
Package Width (mm)
7.24
Package Height (mm)
53.9
Pin Pitch (mm)
1
Mounting
Socket
Main Category
DRAM Module
Total Density
8Gbyte
Module Type
240DIMM
Maximum Clock Rate
2666MHz
Chip Density
2Gbit
Subcategory
DDR3 SDRAM
Data Bus Width
64bit
Number of Chip per Module
32
Organization
512Mx64x2
Chip Package Type
FBGA
Typical Operating Supply Voltage
1.5V
Min Operating Supply Voltage
1.425V
Max Operating Supply Voltage
1.575V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Chip Configuration
256Mx8
ECC Support
No
Number of Ranks
Dual
CAS Latency
11
Compliance
Cage Code
0P2J5
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Kingston KHX26C11T2K2/8X Datasheet
Download the complete datasheet for Kingston KHX26C11T2K2/8X to view detailed technical specifications.
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