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Technical Specifications
Kingston KSM26RD8/32MEI technical specifications.
General
| Main Category | DRAM Module |
| Total Density | 32Gbyte |
| Module Type | 288RDIMM |
| Maximum Clock Rate | 2666MHz |
| Chip Density | 16Gbit |
| Subcategory | DDR4 SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 18 |
| Organization | 4Gx72 |
| Chip Package Type | FBGA |
| Typical Operating Supply Voltage | 1.2V |
| Maximum Operating Current | 1656mA |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 2Gx8 |
| ECC Support | Yes |
| Number of Ranks | Dual |
| CAS Latency | 19 |
| Pin Count | 288 |
| Package/Case | RDIMM |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU |
Datasheet
Kingston KSM26RD8/32MEI Datasheet
Download the complete datasheet for Kingston KSM26RD8/32MEI to view detailed technical specifications.
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