DDR3L SDRAM module offering 12GB total density. This 240-pin RDIMM features a 72-bit data bus width and operates at a maximum clock rate of 1333 MHz with a CAS latency of 9. The module utilizes FBGA packaged chips with a 512Mx4 configuration, organized as 512Mx72x3 with 54 chips per module. Supporting ECC, it operates with a typical voltage of 1.35/1.5V and a temperature range of 0°C to 85°C. The non-lead-frame SMT package is a registered dual in-line memory module designed for socket mounting.
PackageRDIMM
MountingSocket
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Technical Specifications
Kingston KVR13LR9S4K3/12I technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | RDIMM |
| Package Description | Registered Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.35 |
| Package Height (mm) | 30 |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 12Gbyte |
| Module Type | 240RDIMM |
| Maximum Clock Rate | 1333MHz |
| Chip Density | 2Gbit |
| Subcategory | DDR3L SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 54 |
| Organization | 512Mx72x3 |
| Chip Package Type | FBGA |
| Typical Operating Supply Voltage | 1.35/1.5V |
| Min Operating Supply Voltage | 1.28/1.425V |
| Max Operating Supply Voltage | 1.45/1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 512Mx4 |
| ECC Support | Yes |
| Number of Ranks | Single |
| CAS Latency | 9 |
Compliance
| Cage Code | 0P2J5 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Kingston KVR13LR9S4K3/12I Datasheet
Download the complete datasheet for Kingston KVR13LR9S4K3/12I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.