8GB DDR3 Registered DIMM (RDIMM) memory module, operating at 1600 MHz. Features a 240-pin interface with a 1mm pin pitch and a 72-bit data bus width. Organized as 1Gx72 with 36 FBGA chips, each with a 512Mx4 configuration. Supports ECC and dual ranks, with a CAS latency of 11. Designed for socket mounting with a typical operating voltage of 1.5V and an operating temperature range of 0°C to 85°C.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Kingston KVR16R11D4/8I datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | RDIMM |
| Package Description | Registered Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.35 |
| Package Height (mm) | 30 |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 8Gbyte |
| Module Type | 240RDIMM |
| Maximum Clock Rate | 1600MHz |
| Chip Density | 2Gbit |
| Subcategory | SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 36 |
| Organization | 1Gx72 |
| Chip Package Type | FBGA |
| Typical Operating Supply Voltage | 1.5V |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 512Mx4 |
| ECC Support | Yes |
| Number of Ranks | Dual |
| CAS Latency | 11 |
| Cage Code | 0P2J5 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Kingston KVR16R11D4/8I to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
