
DDR3 SDRAM module with 4GB total density, organized as 512Mx72, featuring 240 pins in a DIMM package. This 240RDIMM operates at a maximum clock rate of 1600 MHz with a CAS latency of 11. ECC support is integrated, and it utilizes FBGA chip package type with 18 chips per module, each with a 2G bit chip density and 512Mx4 configuration. The module requires a typical operating supply voltage of 1.5V and is designed for socket mounting.
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| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | DIMM |
| Package Description | Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.35 |
| Package Height (mm) | 30 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 4Gbyte |
| Module Type | 240RDIMM |
| Maximum Clock Rate | 1600MHz |
| Chip Density | 2Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 18 |
| Organization | 512Mx72 |
| Chip Package Type | FBGA |
| Typical Operating Supply Voltage | 1.5V |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 512Mx4 |
| ECC Support | Yes |
| Number of Ranks | Single |
| CAS Latency | 11 |
| Cage Code | 0P2J5 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
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