Tflex HD90000 is a very soft, high-performance thermal gap filler material. It combines high thermal conductivity of 7.5 W/mK with high compressibility, designed to minimize board and component stress while maintaining excellent thermal contact. The material is a silicone-based gap filler that provides low thermal resistance at low pressures and is naturally tacky, requiring no additional adhesive coating.
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Laird A17251-01 technical specifications.
| Thermal Conductivity | 7.5W/mK |
| Thickness | 1.0mm |
| Hardness (3 sec) | 33Shore 00 |
| Density | 3.5g/cc |
| Operating Temperature Range | -50 to 200°C |
| Dielectric Breakdown Voltage | > 5000VAC |
| Volume Resistivity | 10^13ohm-cm |
| Flammability Rating | V-0rating |
| Color | Grey |
| Dimensions | 9 x 9inch |
| RoHS | Compliant |
| REACH | Compliant |
| Ul | UL 94V-0 |
No datasheet is available for this part.
