Tflex SF10 is a high-performance, silicone-free thermal gap filler. It is designed for applications that are sensitive to silicone outgassing or oil bleed. The material provides high thermal conductivity of 10 W/mK and is typically used to fill air gaps between hot components and heat sinks or chassis to improve heat transfer.
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| Thermal Conductivity | 10W/mK |
| Thickness | 2.00mm |
| Dimensions | 229 x 229mm |
| Color | Grey |
| Density | 3.70g/cc |
| Operating Temperature Max | 125Celsius |
| Operating Temperature Min | -40Celsius |
| Silicone Free | Yes |
| RoHS | Compliant |
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