The OTH-Q175863A-00-DN is a high-performance thermal interface material part of the Tpcm 580 series. It is a square, gray phase change compound pad measuring 28mm x 28mm with a thickness of 0.254mm. Designed to minimize contact thermal resistance, the material is tacky on both sides and features a thermal conductivity of 3.8 W/m-K. It is typically used as a gap filler in electronic cooling applications and is classified with a Moisture Sensitivity Level of 1.
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Technical Specifications
Laird OTH-Q175863A-00-DN technical specifications.
General
| Thermal Conductivity | 3.8W/m-K |
| Dimensions (Outline) | 28.00 x 28.00mm |
| Thickness | 0.254mm |
| Material | Phase Change Compound |
| Color | Gray |
| Adhesive | Tacky - Both Sides |
| Moisture Sensitivity Level | 1 (Unlimited)MSL |
Compliance
| RoHS | Compliant |
Datasheet
Laird OTH-Q175863A-00-DN Datasheet
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