System-on-Chip (SoC) featuring an X86 device core and XChip family designation. This CMOS integrated circuit operates at a maximum clock rate of 25 MHz, offering 256KB of RAM. Packaged in a 184-pin, 12mm x 12mm plastic Ball Grid Array (BGA) for surface mounting, it supports a typical operating supply voltage range of 1.8V to 3.3V. The SoC includes 2 programmable I/Os and a UART interface, designed for applications in energy and metering, vending machines, and RFID readers. Operating within a temperature range of -40°C to 85°C, this ROMLess microcontroller is not programmable.
PackageBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Lantronix XCD1001000-01 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 184 |
| PCB | 184 |
| Package Length (mm) | 12 |
| Package Width (mm) | 12 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | XChip |
| Device Core | X86 |
| Maximum Clock Rate | 25MHz |
| Program Memory Type | ROMLess |
| Maximum Speed | 25MHz |
| Process Technology | CMOS |
| RAM Size | 256KB |
| Type | System-On-Chip |
| Processing Unit | Microcontroller |
| Typical Operating Supply Voltage | 1.8|3.3V |
| Number of Programmable I/Os | 2 |
| Application | Energy and Metering/Vending machines/RFID readers |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Interface Type | UART |
| Programmability | No |
Compliance
| Cage Code | 028A6 |
| EU RoHS | Yes |
| HTS Code | 8517690000 |
| Schedule B | 8517690000 |
| ECCN | 5A991 |
| RoHS Versions | 2011/65/EU |
Datasheet
Lantronix XCD1001000-01 Datasheet
Download the complete datasheet for Lantronix XCD1001000-01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.