PackageDIP Module
MountingThrough Hole
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Technical Specifications
Ledtech Electronics UC3671-11-M1-EWAK technical specifications.
General
Package/Case
DIP Module
Package Description
Dual In Line Module
Pin Count
10
PCB
10
Package Length (mm)
14
Package Width (mm)
7.5
Package Height (mm)
8.46
Pin Pitch (mm)
2.54
Mounting
Through Hole
Type
Module
Color
SB. Red
Number of Digits
1
Configuration
Common Anode
Digit Size
0.36in
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Intensity
6000ucd
Maximum Forward Current
30mA
Maximum Forward Voltage
2.2V
Maximum Reverse Current
100uA
Viewing Area Height
9.144mm
Compliance
HTS Code
8531200040
Schedule B
8531200040
ECCN
EAR99
Radiation Hardening
No
Datasheet
Ledtech Electronics UC3671-11-M1-EWAK Datasheet
Download the complete datasheet for Ledtech Electronics UC3671-11-M1-EWAK to view detailed technical specifications.
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