PackageDIP Module
MountingThrough Hole
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Technical Specifications
Lite-On LTG-Y2K19BM technical specifications.
General
Package Family Name
DIM
Package/Case
DIP Module
Package Description
Dual In Line Module
Pin Count
14
PCB
14
Package Length (mm)
16.5(Max)
Package Width (mm)
16.5(Max)
Package Height (mm)
6.5
Mounting
Through Hole
Type
Panel
Color
P. Green/Yellow
Number of Digits
3
Configuration
Common Anode
Digit Size
0.2in
Min Operating Temperature
-35°C
Max Operating Temperature
105°C
Intensity
2000/15600ucd
Maximum Forward Current
25mA
Maximum Forward Voltage
2.6V
Maximum Reverse Current
100uA
Viewing Area Height
5.08mm
Viewing Area Length
2.8mm
Compliance
EU RoHS
Yes with Exemption
HTS Code
8531200040
Schedule B
8531200040
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lite-On LTG-Y2K19BM Datasheet
Download the complete datasheet for Lite-On LTG-Y2K19BM to view detailed technical specifications.
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