PackageDIP Module
MountingThrough Hole
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Technical Specifications
Lite-On LTG-Y2K19M-01 technical specifications.
General
Package Family Name
DIM
Package/Case
DIP Module
Package Description
Dual In Line Module
Pin Count
14
PCB
14
Package Length (mm)
16.5(Max)
Package Width (mm)
16.5(Max)
Package Height (mm)
8
Mounting
Through Hole
Type
Panel
Color
P. Green
Number of Digits
3
Configuration
Common Anode
Digit Size
0.2in
Min Operating Temperature
-35°C
Max Operating Temperature
105°C
Intensity
2000ucd
Maximum Forward Current
25mA
Maximum Forward Voltage
2.6V
Maximum Reverse Current
100uA
Viewing Area Height
5.08mm
Viewing Area Length
2.8mm
Compliance
Cage Code
Lite-On IT Corporation Cage Code: SGX45
EU RoHS
Yes with Exemption
HTS Code
8531200040
Schedule B
8531200040
ECCN
EAR99
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lite-On LTG-Y2K19M-01 Datasheet
Download the complete datasheet for Lite-On LTG-Y2K19M-01 to view detailed technical specifications.
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