PackageTSSOP EP
MountingSurface Mount
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Technical Specifications
Maxim MAX16814BUUP+ technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP EP
Package Description
Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
6.6(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AC
Output Voltage
5V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
40V
Maximum Power Dissipation
2122mW
Maximum Supply Current
5000uA
Min Operating Supply Voltage
4.75V
Typical Operating Supply Voltage
5|9|12|15|18|24V
Compliance
Cage Code
1ES66
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MAX16814BUUP+ Datasheet
Download the complete datasheet for Maxim MAX16814BUUP+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.