PackageDIP
MountingThrough Hole
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Technical Specifications
Maxim ZLP32300P2008G technical specifications.
General
| Package/Case | DIP |
| Core Architecture | Z8 |
| Max Operating Temperature | 70°C |
| Memory Size | 8KB |
| Memory Type | OTP, |
| Min Operating Temperature | 0°C |
| Mount | Through Hole |
| Number of I/Os | 16 |
| Oscillator Type | Internal |
| Packaging | Rail/Tube |
| Peripherals | Brown-out Detect/Reset, POR, WDT, HLVD |
| RoHS Compliant | No |
| Series | Crimzon™ ZLP |
Compliance
| RoHS | Not Compliant |
Datasheet
Maxim ZLP32300P2008G Datasheet
Download the complete datasheet for Maxim ZLP32300P2008G to view detailed technical specifications.
No datasheet is available for this part.