8331D is an electrically conductive, 2-part silver epoxy adhesive that is smooth, non-sagging, and thixotropic. It bonds well to a wide variety of substrates and allows for quick, cold-soldering repairs. It is frequently used as a solder replacement for bonding heat-sensitive electronic components or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. It provides excellent EMI/RFI shielding and is highly effective for filling seams between metal plates.
MG Chemicals 8331D-120G technical specifications.
| Mix Ratio | 1:1By Volume |
| Working Time | 20minutes |
| Cure Time @ Room Temperature | 6hours |
| Cure Time @ 65 °C | 10minutes |
| Viscosity (Mixed) | 130Pa·s |
| Density (Mixed) | 2.4g/mL |
| Net Weight | 120g |
| Net Volume | 50mL |
| Thermal Conductivity | 1.5W/m·K |
| Shelf Life | 1095days |
| RoHS | Compliant |
| Svhc | Free |
Download the complete datasheet for MG Chemicals 8331D-120G to view detailed technical specifications.
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