The 8349TFM is a 2-part, 1:1 ratio, thermally conductive epoxy adhesive. It is a smooth, dark, off-grey paste that cures to form a hard, durable polymer that is thermally conductive yet electrically insulating. It is designed to bond heatsinks to CPUs, LEDs, and other electronic components. It provides high dimensional stability and strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons. The product meets UL 94V-0 flammability standards and can be cured at room temperature or accelerated with heat.
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| Thermal Conductivity | 1.1W/(m·K) |
| Mix Ratio | 1:1By Volume |
| Working Life | 20minutes |
| Cure Time | 16 @ 22 °Chours |
| Heat Cure Time | 20 @ 65 °Cminutes |
| Compressive Strength | 41N/mm² |
| Tensile Strength | 14N/mm² |
| Volume Resistivity | 1.0 x 10^13Ω·cm |
| Flame Retardant | UL 94V-0 |
| RoHS | Compliant |
