256Mbyte SDRAM DRAM Module, 168-pin UDIMM, featuring 32Mx64 organization and 64-bit data bus width. Operates at a maximum clock rate of 100 MHz with a CAS Latency of 2. This unbuffered dual in-line memory module utilizes 8 x 256M bit TSOP chips, offering 32Mx8 chip configuration. Supports a typical operating supply voltage of 3.3V, with a range of 3V to 3.6V, and operates within a temperature range of 0°C to 70°C. Designed for socket mounting with a non-lead-frame SMT basic package type.
PackageUDIMM
MountingSocket
Quick Jump:
Technical Specifications
Microchip W3DG6435V10D2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
UDIMM
Package Description
Unbuffered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
168
PCB
168
Package Length (mm)
133.48(Max)
Package Width (mm)
2.54(Max)
Package Height (mm)
30.48(Max)
Mounting
Socket
Main Category
DRAM Module
Total Density
256Mbyte
Module Type
168DIMM
Maximum Clock Rate
100MHz
Chip Density
256Mbit
Subcategory
SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
32Mx64
Chip Package Type
TSOP
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
880mA
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
32Mx8
ECC Support
No
CAS Latency
2
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip W3DG6435V10D2 Datasheet
Download the complete datasheet for Microchip W3DG6435V10D2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.