128Mbyte SDRAM module featuring a 144-pin USODIMM package for socket mounting. This unbuffered memory module operates at a maximum clock rate of 100 MHz with a 72-bit data bus width, organized as 16Mx72. It supports ECC and boasts a CAS latency of 2, with chip densities of 128M bit (16Mx8 configuration). Operating voltage ranges from 3V to 3.6V, with a typical current draw of 1485 mA, and a wide operating temperature range of -40°C to 85°C.
PackageUSODIMM
MountingSocket
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Technical Specifications
Microchip W3DG7216V10AD1I technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
USODIMM
Package Description
Unbuffered Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
144
PCB
144
Package Length (mm)
67.72(Max)
Package Width (mm)
3.81(Max)
Package Height (mm)
27.94(Max)
Mounting
Socket
Main Category
DRAM Module
Total Density
128Mbyte
Module Type
144SODIMM
Maximum Clock Rate
100MHz
Chip Density
128Mbit
Subcategory
SDRAM
Data Bus Width
72bit
Number of Chip per Module
9
Organization
16Mx72
Chip Package Type
TSOP
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
1485mA
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Chip Configuration
16Mx8
ECC Support
Yes
CAS Latency
2
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8473301140
Schedule B
8473300002
ECCN
4A994.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip W3DG7216V10AD1I Datasheet
Download the complete datasheet for Microchip W3DG7216V10AD1I to view detailed technical specifications.
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