128Mbyte SDRAM DRAM Module, 144-pin USODIMM, 133 MHz maximum clock rate, 72-bit data bus width, and 3 CAS latency. Features 16Mx72 organization with 128Mbit chip density, 16Mx8 chip configuration, and ECC support. Operates at 3.3V typical supply voltage with a 0°C to 70°C temperature range. Non-lead-frame SMT mounting via socket.
PackageUSODIMM
MountingSocket
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Technical Specifications
Microchip W3DG7216V75AD1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
USODIMM
Package Description
Unbuffered Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
144
PCB
144
Package Length (mm)
67.72(Max)
Package Width (mm)
3.81(Max)
Package Height (mm)
27.94(Max)
Mounting
Socket
Main Category
DRAM Module
Total Density
128Mbyte
Module Type
144SODIMM
Maximum Clock Rate
133MHz
Chip Density
128Mbit
Subcategory
SDRAM
Data Bus Width
72bit
Number of Chip per Module
9
Organization
16Mx72
Chip Package Type
TSOP
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
1485mA
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
16Mx8
ECC Support
Yes
CAS Latency
3
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip W3DG7216V75AD1 Datasheet
Download the complete datasheet for Microchip W3DG7216V75AD1 to view detailed technical specifications.
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