128Mbyte SDRAM DRAM Module, 144-pin USODIMM, 133 MHz maximum clock rate, 72-bit data bus width, and 3 CAS latency. Features 16Mx72 organization with 128Mbit chip density, 16Mx8 chip configuration, and ECC support. Operates at 3.3V typical supply voltage with a 0°C to 70°C temperature range. Non-lead-frame SMT mounting via socket.
PackageUSODIMM
MountingSocket
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Technical Specifications
Microchip W3DG7216V75AD1 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | USODIMM |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 144 |
| PCB | 144 |
| Package Length (mm) | 67.72(Max) |
| Package Width (mm) | 3.81(Max) |
| Package Height (mm) | 27.94(Max) |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 128Mbyte |
| Module Type | 144SODIMM |
| Maximum Clock Rate | 133MHz |
| Chip Density | 128Mbit |
| Subcategory | SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 9 |
| Organization | 16Mx72 |
| Chip Package Type | TSOP |
| Typical Operating Supply Voltage | 3.3V |
| Maximum Operating Current | 1485mA |
| Min Operating Supply Voltage | 3V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Chip Configuration | 16Mx8 |
| ECC Support | Yes |
| CAS Latency | 3 |
Compliance
| Cage Code | 60991 |
| EU RoHS | No |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Microchip W3DG7216V75AD1 Datasheet
Download the complete datasheet for Microchip W3DG7216V75AD1 to view detailed technical specifications.
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